Calcined α‑Al₂O₃ filler, CAS 1344‑28‑1, D50 4‑4.9 μm. It is produced by high‑temperature calcination, milling and multi‑stage classification to form stable alpha‑phase alumina particles. This inorganic filler is used for EMC epoxy molding compound, CPO advanced semiconductor encapsulation and general thermoset resin. It improves hardness, dimensional stability and thermal conductivity of cured resin while controlling expansion coefficient for microelectronic packaging applications.

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Product Detail PageCalcined Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 4‑4.9μm for EMC CPO Encapsulation & Resin FillerThis calcined alpha alumina filler is manufactured via high‑temperature calcination of alumina precursors, followed by mechanical grinding, de‑agglomeration and multi‑step air classification. The thermal calcination process completes crystal transformation to stable α‑Al₂O₃ phase. Median particle‑size range is tightly controlled between 4 μm and 4.9 μm. Strict classification eliminates oversized grit and excessive ultrafine fines, delivering consistent particle‑size distribution suitable for epoxy molding compound production.

Compared with fused spherical alumina, calcined alumina exhibits irregular polyhedral particle morphology with moderate hardness and lower production cost. When compounded into EMC epoxy molding compound, the rigid alumina particles reinforce the cured epoxy matrix. They effectively reduce thermal expansion coefficient of molding compound, improve flexural modulus, surface hardness and anti‑abrasion performance of finished encapsulation parts.

For CPO semiconductor encapsulation applications, this calcined alumina filler is incorporated within epoxy‑based molding formulations. It assists in dissipating heat generated by operating chips and restrains dimensional variation of encapsulant during thermal cycling. Raw‑material purification reduces soluble alkali‑metal and ionic impurities, minimizing ion‑migration risk under high‑temperature and humid working conditions, which safeguards long‑term insulation reliability of CPO packaging modules.

This calcined alumina filler demonstrates good compatibility with standard epoxy resin systems for electronic molding compounds. Silane surface modification can be applied on request. Surface treatment improves interfacial bonding between alumina particles and epoxy polymer matrix, enhancing moisture‑resistance and mechanical strength of cured EMC composites. It can be blended with other fine or coarse mineral fillers to formulate customized graded particle‑size distribution, adjusting flow behavior and filling density for different EMC and CPO encapsulation recipes.

The powder product requires sealed dry storage to prevent moisture absorption prior to compounding. During weighing, conveying and feeding operations, cross‑contamination with fused spherical alumina or coarse lapping‑grade alumina should be strictly avoided, which would shift particle‑size distribution and negatively affect molding flow properties of EMC materials. This D50 4‑4.9 μm calcined α‑alumina filler serves as a cost‑effective reinforcing inorganic filler for EMC epoxy molding compound, CPO semiconductor encapsulation and electronic thermoset resin systems.

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Calcined Alumina Filler α‑Al₂O₃ CAS 1344‑28‑1, D50 4‑4.9μm for EMC CPO Encapsulation & Resin Filler

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.