CPO Optical Encapsulant High-Refractive Index with Nano Spherical Silica, for Photonic Chip Fiber Coupling Low-Stress
CPO Optical Encapsulant is a high‑refractive index curable resin system modified with uniformly dispersed nano spherical silica filler. The nano‑sized spherical silica reduces curing shrinkage and modulus, enabling low‑stress performance. This optical encapsulant is intended for the photonic‑chip‑fiber coupling zone of CPO assemblies. It maintains precise optical alignment, minimizes optical losses and enhances long‑term thermomechanical reliability of high‑speed optoelectronic interconnection s
Product Detail PageCPO Optical Encapsulant High‑Refractive Index with Nano Spherical Silica, for Photonic Chip Fiber Coupling Low‑StressThis CPO optical encapsulant is manufactured by compounding high‑refractive‑index base resin with purified nano spherical silica. The nano spherical silica filler is subjected to dedicated surface treatment before dispersion into the resin matrix under vacuum and high‑shear mixing. Strict filtration removes oversized particles and micro‑gel impurities to eliminate potential light‑scattering defects. The whole production process is controlled under low‑particle clean‑room conditions to satisfy opto‑electronic grade requirements for photonic packaging.
When applied at photonic chip‑to‑fiber coupling regions inside CPO modules, the cured encapsulant forms a transparent optical medium between the waveguide facets of silicon photonic chips and the end‑faces of single‑mode optical fibers. The tailored high refractive‑index helps to reduce refractive‑index discontinuity at the coupling interface, lowering Fresnel reflection and insertion loss for high‑speed optical signal transmission. Homogeneously distributed nano spherical silica restricts polymer‑network contraction during curing, effectively suppressing curing‑induced shrinkage stress at the delicate fiber‑chip junction.
Low‑stress characteristics remain critical under cyclic thermal fluctuations in server operating environments. The nano‑silica modified resin moderates the overall modulus of cured encapsulation. It relieves thermally‑generated shear stress across the fiber‑photonic‑chip bonding interface, preventing micro‑displacement of optical fiber relative to the photonic waveguide. This property preserves precise optical alignment and avoids drifting of coupling efficiency after prolonged thermal cycling, which is indispensable for stable data‑transmission performance of CPO hardware in data‑center infrastructure.
The encapsulant can be formulated for either thermal curing or UV‑LED curing according to customer process workflows such as precision dispensing, capillary under‑fill and localized potting. Further adjustments on refractive index, filler loading and curing kinetics are feasible to match different photonic chip designs and fiber specifications. The nano spherical silica filler also improves the hardness and anti‑aging performance of cured resin without introducing visible haze or light‑scattering centers.
The optical encapsulant should be stored in hermetically sealed containers under refrigerated cool conditions. Direct exposure to elevated temperature before usage may trigger premature polymerization. During dispensing and curing operations, clean‑room processing is strongly recommended to avoid airborne dust contamination, as foreign particulates inside the coupling gap will induce severe optical loss. Cross‑contamination with conventional opaque inorganic fillers must be strictly prevented during material handling. This high‑refractive‑index optical encapsulant reinforced with nano spherical silica serves as a specialized low‑stress optical material for photonic chip‑fiber coupling encapsulation of advanced co‑packaged optics modules.
Copy product links
Long by picture save/share
Add Successfully
CPO Optical Encapsulant High-Refractive Index with Nano Spherical Silica, for Photonic Chip Fiber Coupling Low-Stress
Add Successfully
Jishengya Technology
Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.
点击右上角
分享给朋友吧
Copyright © 2005-2026 Shenzhen Jishengya Technology Co., Ltd. All Rights Reserved.
