CPO Encapsulation Compound is a composite sealing material formulated with epoxy or silicone resin matrix and graded spherical inorganic fillers. Through precise multi‑modal particle‑size formulation, this encapsulation compound achieves balanced rheological behavior, low moisture permeability and favorable mechanical properties. It is applied for sealing and moisture insulation of co‑packaged optics assemblies, protecting photonic chips and high‑speed optical interconnection components against

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Product Detail PageCPO Encapsulation Compound Epoxy/Silicone Resin with Spherical Filler, for Co‑Packaged Optics Sealing Moisture InsulationThis CPO encapsulation compound is manufactured by high‑speed compounding of epoxy or silicone base resin together with selected spherical inorganic fillers. Multi‑modal spherical filler grading is adopted to maximize filling loading while controlling the viscosity of resin system. Raw materials are subjected to rigorous purification to reduce ionic impurities, which is essential for long‑term electrical reliability of high‑density optoelectronic devices. Vacuum degassing is implemented during production to minimize micro‑voids inside finished encapsulation compound.

When deployed for CPO co‑packaged optics sealing, the cured compound forms a continuous protective layer over photonic chips, optical waveguides and high‑speed electrical circuit traces. The dense cured matrix delivers excellent moisture‑barrier performance, slowing the penetration of water vapor and corrosive ambient contaminants into the delicate chip region. It effectively suppresses electrochemical migration and metal corrosion on fine‑pitch circuit structures under high‑humidity operating environments inside data‑center servers.

The spherical filler morphology reduces internal stress during curing and subsequent thermal cycling. It helps to match the coefficient of thermal expansion between encapsulation material and semiconductor substrate. Thermal‑cycling‑induced interfacial shear stress is alleviated, lowering the risk of interfacial delamination between encapsulant and photonic chip. Stable interfacial bonding preserves precise optical alignment for fiber‑chip coupling structures of CPO modules under repeated temperature fluctuation.

Both epoxy‑based and silicone‑based grades are available. Epoxy variant provides higher hardness, superior mechanical strength and good chemical resistance. Silicone grade features lower modulus and better stress‑relief capability, which is favorable for ultra‑sensitive photonic chips. Customized filler loading and curing profiles can be adjusted according to customer processing conditions including transfer molding, dispensing and potting processes.

Strict sealed storage under cool and dry conditions is required for the encapsulation compound. Avoid direct exposure to humid air before application to prevent moisture absorption of resin component. During dispensing or molding processing, adequate vacuum degassing should be performed to eliminate trapped air and prevent void formation within the sealing layer. Void defects would degrade moisture insulation and accelerate long‑term module failure. This CPO encapsulation compound with spherical inorganic filler serves as critical sealing and moisture‑insulation material for high‑reliability co‑packaged optics assemblies in high‑performance server systems.

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CPO Encapsulation Compound Epoxy/Silicone Resin with Spherical Filler, for Co-Packaged Optics Sealing Moisture Insulation

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Jishengya Technology

Shenzhen Jishengya Technology Co., Ltd. is located in Shenzhen, a special economic zone, and is a comprehensive technology enterprise integrating independent R&D, production and sales.